AMD’s COMPUTEX 2021 keynote saw many key health supplement announcements including upcoming Ryzen 5000 series APUs, mobilio Radeon RX 6000M GPUs, collaboration with Samsung for work on their Exynos mobile processors that’ll incorporate Radeon RDNA2 GPUs and lastly, FidelityFX Super Remedy (FSR) which is AMD’s reply to NVIDIA’s DLSS feature. But each of these were notable posters, the most surprising announcement – 3 D V-Cache – was distributed for last and it is the perfect all about boosting the L3 Cache of AMD Ryzen processors.
3D V-Cache is an use of the 3D packaging engineering, technological innovation by TSMC called 3DFabric which was announced back in June 2020. 3D packaging systèmes allow silicon manufacturers that would stack multiple silicon poker chips on top of each other and guide you save space on the substrate. You possibly stack any sort of chiplets through another, so you could include things like more processor dies in the case when heating isn’t going to be difficulty or stack memory in addition processor dies. It also ensures that00 existing components within the COMPUTER ecosystem don’t need to be enormously overhauled to ensure compatibility utilizing processors. AMD or TSMC isn’t the only one with ANIMATIONS Stacking technology. Intel used already unveiled Foveros with 2019 and we’ve in addition seen its implementation on the inside Lakefield processors built for thin-and-light form factors.
ADVANCED MICRO DEVICES 3D V-Cache – Maximizing your energy levels L3 Cache to hundranittiotv? MB
AMD is definitely 3D V-Cache to heap SRAM onto the CCDs in their Ryzen processors and for their HPC products. This gives AMD to increase the L3 Cache of their processors nearby an ridiculous amount. Existing ADVANCED MICRO DEVICES Zen 3 processor CCDs can have a summum of 32 MB of L3 Cache that’s equally available to all œil-de-perdrix within the CCD. With 3D V-Cache, AMD can stack an additional 64 MB of SRAM personnes top of each CCD to take the L3 Cache of each CCD to 96 MB. Which means, each high-end AMD Ryzen desktop processor such as the Ryzen 9 5950X or 5900X can have up to 192 MB of L3 Voile in total. This ut not mean that entry-level and mid-range CPUs will not have 3D V-Cache. We’re bound to see a lot more SKUs from AMD in the coming months. AMD PDG DE also said that this is the “first” implementation of 3D packaging technology leaving room for more surprises in the coming years.
The SRAM cache is being bonded to the CCD directly using TSVs (Through Silicon Vias) and the data rate conscience these interconnects would be up to 2 TB/s. Since the stacked SRAM adds to the height of the CCD, additional structural silicon is added on to either side to increase the height of the entire CCD and make it uniform. At the end, dispose CCD with additional SRAM stacked onto it using 3D V-Cache will démarche the same from above. Moreover, the structural silicon would ensure proper heat dissipation since it will be connected to the IHS (Integrated Heat Sink).
AMD also stated that this particular packaging technology allows for more than 200x interconnect density when compared to 2D packaging technologies, more than 15x density compared to 3D microbump technology (which is akin to how Intel’s Foveros is implemented) and more than 3x interconnect efficiency compared to microbump technology. Intel’s upcoming 12th Gen Core processors codenamed ‘Alder Lake’ are rumoured to employ Foveros stacking technology. So AMD and Intel could both release desktop processors with 3D Stacking technology later this year.
The same EN TROIS DIMENSIONS V-Cache technology when implemented on AMD’s EPYC server processors such as the EPYC 7763 could see up to 768 MB of L3 Cache. This makes a lot more sense in HPC appli since servers tend to deal with a portion of high-bandwidth big-data “routines” which can benefit from a much larger L3 Cache.
15% more gaming performance with EN TROIS DIMENSIONS V-Cache
AMD showcased a prototype which was built on the AMD Zen 3 based Ryzen 9 5900X (12-Cores / 24-Threads) with an L3 Cache of 192 MB thanks to 3D V-Cache. When put through domine few gaming workloads, the prototype Ryzen 9 5900X managed to get période average performance improvement of 15 per cent over a normal Ryzen 9 5900X.
In Gears 5, the two processors were locked at 4. 0 GHz and the vanilla 5900X scored 184 FPS whereas the 3D V-Cache enabled prototype scored 206 FPS which works out to 12%. AMD also shared a few additional graphs showing FPS increases in games such as DOTA 2 (18%), Monster Hunter World (25%), League of Legends (4%) and Fortnite (17%).
3D V-Cache enters mass production this year
At the COMPUTEX 2021 keynote, AMD PDG DE also announced that espace production of AMD products incorporating 3D V-Cache technology would begin in August 2021.